PRESENTE Y FUTURO DE LA IMPRESIÓN FUNCIONAL

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Normativa en Impresión Electrónica

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ELECTRÓNICA IMPRESA

¿

Qué es la electrónica impresa?

Conjunto de técnicas de impresión.

Técnicas tradicionales de artes gráficas

Flexografía, Inkjet, Serigrafía…

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Electrónica

Impresa

Flexibilidad

Técnicas

Bajo coste

Bajo

consumo

energético

¿Qué ventajas tiene la electrónica impresa?

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Flexografía

Flexografía

Flexografía

Flexografía

R2R

S2S

Tintas dieléctricas

VALIDACIÓN

VALIDACIÓN

VALIDACIÓN

VALIDACIÓN

FLAKES

FLAKES

FLAKES

FLAKES

OLED

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JEITA Japan Electronics and Information

Technologies Association

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IEC-TC 119 WG-1 TERMINOLOGY

• Objetivo: Producir terminología para el

campo de la electrónica impresa

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IEC-TC 119 WG-2 MATERIALS

• Objetivo:

– Desarrollar métodos de medida y evaluación

para materiales como sustratos, tintas y otros

materiales de PE.

– Analizar la efectividad de métodos existentes

para PE

– Definir términos específicos, requerimientos

y especificaciones para materiales de PE

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IEC-TC 119 WG-2 MATERIALS

Document number Title of document Summary

IEC 62899-20x-Part204 PRINTED ELECTRONICS – Part 204: Materials - Insulator ink

This part of the IEC 62899 defines terms, and specifies standard methods for characterisation and evaluation of insulator inks and insulator layer

that is made from

insulator inks used for printed electronics

119/46/NP Printed electronics - Materials - Part 10-100: Silver wire ink (film resistance)

Provides a standardized method to evaluate the electrical performance of transparent conductive films of networked Ag nanowires

119/73/NP

PRINTED ELECTRONICS — Part 202-3: MATERIALS — Conductive ink —Measurement of sheet resistance of conductive films (non-contact style)

This International Standard defines terms, and specifies a standard method for measurement of sheet resistance of printed conductive films

using a noncontact eddy current method.

119/90/CD IEC 62899-203 Ed.1: Printed Electronics - Part 203: Materials - Semiconductor ink

This International Standard defines terms, and specifies standard methods for characterisation and evaluation. It is applicable to

semiconductor inks and semiconducting layers that are made from semiconductor inks.

119/87/FDIS IEC 62899-201 Ed.1: Printed electronics – Part 201: Materials – Substrates

This part of IEC 62899 defines the terms and specifies the evaluation method for substrates used in the printing process to form electronic components/devices. This international standard is also applied to the

substrates which make surface treatment in order to improve their performance

119/88/FDIS IEC 62899-202 Ed.1: Printed electronics – Part 202: Materials – Conductive ink

This part defines the terms and specifies the standard methods for characterisation and evaluation. It is applicable to conductive inks and

conductive layer that are made from conductive inks

119/103/NP

Printed electronics — Part 202-1: Materials — Measurement method of dispersion property in

This International Standard provides a standardized method to evaluate the dispersion property of silver ink. The method described in this

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IEC-TC 119 WG-3 EQUIPMENT

• Objetivo: Estandarización de equipos de

impresión y recubrimiento, herramientas,

sub-unidades y partes para producción de

PE

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IEC-TC 119 WG-3 EQUIPMENT

Docum ent num ber Title of docum ent Sum m ary

119/64/CD IEC 62904 Ed.1: Printed electronics - Equipment - Inkjet - Measurement method of jetting spedd

Provides the method for determining inkjet jetting speed based on visualized droplet images obtained by the drop visualization system.

119/68/NP

Printed Electronics - Equipment - Inkjet-head - Measurement method of drop volume

This specifies the method for determining inkjet drop volume based on visualized droplet images obtained by drop visualization systems

119/82/CDV

IEC 62899-301-1 Ed.1: Printed Electronics - Part 301-1: Equipment - Contact printing - Rigid master - Measurement method of plate master external dimension

This document defines measurement terms and methods related to the external dimension of a rigid plate master.

119/83/CDV

IEC 62899-301-2 Ed.1: Printed Electronics - Part 301-2: Equipment - Contact printing - Rigid master - Measurement method of plate master pattern dimension

This document defines measurement terms and methods related to the critical dimension of features and the registration accuracy of features on rigid plate master.

119/98A/CDV IEC 62899-302-1: Printed electronics - Part 302-1: Equipment – Inkjet - Imaging based measurement of jetting speed

This International Standard specifies the method for determining inkjet drop speed based on visualized droplet images obtained by a drop analysis system. This measurement standardization is limited to drop on demand type of inkjet and may not applicable to continuous inkjet. It includes the test process, image processing softw are algorithm, and analysis of jetting behavior

This international standard defines the mechanical dimensions related to the printing equipement especially for roll-to-roll printing equipment. Although 'Printed Electronics' is getting popular, and the requrement of having printing equipment for this applicaion is increasing accordingly, because of the nature of printed electronics, unlike conventional printers for conventional printed matter, such

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IEC-TC 119 WG-4 PRINTABILITY

• Objetivo: Las mediciones o los requisitos tanto

de las cualidades de los patrones impresos

como la reproducibilidad de los diseños de

debido a la interacción de medios de impresión,

tintas, sustratos, y las condiciones ambientales.

Los medios de impresión incluyen las partes

involucradas en el proceso de impresión, tales

como placa, cliché, manta, la boquilla, etc., con

exclusión de tintas y sustratos.

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IEC-TC 119 WG-4 PRINTABILITY

Document number

Title of document

Scope

119/106/NP

IEC 62899-402-2: Printed Electronics – Part 402-2:

Printability Measurement of qualities

-Edge waviness

This International Standard specifies the measurement method of the edge waviness of the

printed

patterns in printed electronics.

119/75/CDV

IEC 62899-1 Ed.1: Printed Electronics – Part

402-1: Printability -Measurement of Qualities –

Pattern width

This International Standard specifies the measurement methods of the widths of the printed

patterns in printed electronics. They are treated as two dimensional on a substrate. When the

patterns are definitely affected by three dimensional configurations,these are specified in

measurement methods for thickness in printed electronics

119/76/CD

IEC 62899-401 Ed.1: Printed Electronics - Part 401:

Printability – Guideline

This part of IEC 62899 specifies guideline concerned with the measurements and the

requirements for the printability in the printed electronics.

119/99A/CDV

IEC 62899-401 Ed.1: Printed Electronics - Part 401:

Printability - Overview

This part of IEC 62899 provides an introduction to the rest of the IEC 62899-400 subseries and

explains its modular structure. It specifies the measurements and the requirements of both

the qualities and the reproducibility of printed patterns as the result of the interaction of

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IEC-TC 119 WG-5 QUALITY ASSESMENT

• Objetivo:

Definir

métodos

de

ensayo

y

procedimientos para las medidas de parámetros

específicos en diversos productos. Evaluación

de ciclo de vida y pruebas de fiabilidad de

componentes o productos electrónicos impresos

y/o flexibles

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IEC-TC 119 WG-5 QUALITY ASSESMENT

119/71/CD

IEC 62899-502-1 Ed.1: Printed Electronics

Part 502-1: Quality

assessment

OLED elements

Mechanical stress testing of OLED

elements formed on flexible substrates

This part of IEC 62899-502 specifies mechanical stress test methods

for reliability assessment . There are applicable to flexible OLED

(Organic light emitting diode)

elements formed on flexible substrates by printed electronics

technology

119/86/NP

IEC 62899-503: Printed Electronics – Part 503 : Quality Assessment –

Test method for the channel properties of the printed thin-film

transistor

This document first describes an evaluation protocol for channel

charge trapping and channel capacitance to test the function of fully

printed thin film transistors (TFTs) and describes a method for

characterizing fully printed TFTs including measurement techniques

and testing conditions

119/105/CDV

IEC 62899-502-1 Ed.1: Printed Electronics – Part 502-1 Quality

assessment – OLED elements

Mechanical stress testing of OLED

elements formed on flexible substrates

This part of IEC 62899 specifies quality assessment methods,

especially mechanical stress test methods, for reliability

assessment.It is applicable to flexible OLED (Organic light emitting

diode) elements formed on flexible substrates by printed

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Normativa en Impresión Electrónica

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