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SWAP DM: preliminary design and schematics of a DM for extreme adaptive optics

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SWAP DM: preliminary design and

schematics of a DM for extreme adaptive optics

Funding:

(2)

Fraunhofer Institute for Applied Optics and Precision Engineering IOF

 About 7000 m² floor space

 204 Employees + 72 Students

 Budget 2014: 25,0 mn. € (45 % industry projects)

Design

& Simulation

Manu- facturing

Optical &

Precision Engineering Components

Opto- mechanical

Systems Integration Application

(3)

 Design and manufacturing of various deformable mirrors

 40 actuator high power DM for laser communication

 > 6 kW cw focussing DM

 DM for cryogenic applications

 AO system design

 Design and implementation of a real-time portable AO box for laser communication

 WFS design

1. Background

Active and Adaptive Optics Group

Long term stable Giant DM

Cylindrical Mirror

High Power Focus Mirror

(4)

Structure

1) Requirements 2) Schematics

3) Preliminary Design 4) Breadboards

5) Summary and Outlook

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Structure

1) Requirements 2) Schematics

3) Preliminary Design 4) Breadboards

5) Summary and Outlook

(6)

Requirements Mirror surface

 Ring-shaped mirror

 Activated outer diameter 450 mm

 Passive inner diameter 108 mm

 Reflectivity

 97% @ 450-1000 nm

 98% @ 1000-2000 nm

 Mirror roughness < 1.5 nm rms

 Mirror surface flatness

 Defocus <2 µm PtV

 High order modes Σ (Z5-Z11) <2 µm PtV

 after subtraction of modes with PZT activation ≤ 10 nm rms

(7)

Requirements

Actuation Capability

 11,000 actuators within the aperture

 Actuator pitch of 3.7 mm

 Bidirectional activation ±1.5 μm

 Interactuator stroke 1.2 µm

 Compensation for hysteresis and non-linearity

 Initial failure rate 5 stacks (out of 11,000)

Replaceable actuator units  SWAP DM

(8)

Structure

1) Requirements 2) Schematics

3) Preliminary Design 4) Breadboards

5) Summary and Outlook

(9)

Schematics

 Usage of PICMA® stack actuators

 High force generation

 High resolution

 Full-ceramic insulation for long lifetime and increased reliability

 Small foot prints avaliable

Actuator selection

Exchangeability of actuator modules

(10)

Schematics

Technical Principle

Spring

Piezoelectric stack Support structure Pin

Mirror

Bottom plate Wiring

3.7 mm

1.2 µm

>1.2 µm 1.2 µm

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Side view

Schematics

Schematic System Design

3 x 120°

Bipod flexures

Mirror Shell

Front view

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Structure

1) Requirements 2) Schematics

3) Preliminary Design 4) Breadboards

5) Summary and Outlook

(13)

Preliminary Design Actuator Properties

 Increasing module size

 fewer modules need to be installed

 larger force acting on the bottom plate and its fixation

Number of actuator modules over the actuators per module

 thickness of the support structure vs. degree of acentricity

(14)

Preliminary Design Actuator Properties

 7,2 µm stroke @ 0 N force down to 0 µm at 125 N

 2 µm bias-stroke

 2.2 µm additional stroke to initially flatten mirror surface Calculation of the working point at 48 V

(15)

Structure

1) Requirements 2) Schematics

3) Preliminary Design 4) Breadboards

5) Summary and Outlook

(16)

Breadboards

Manufacturing Process of Modules

Top

Holder

Piezo stack

Module base plate

 Gluing process of piezo stack with holder

 Handling and alignment procedure

 Electrical contacting Goals:

 Evaluation of:

 Manufacturing accuracy

(17)

Plate

Soft layer

Glass substrate Substrate

fixation

Breadboards

Gluing of the mirror surface

Goals:

 Evaluation of:

Tool for tensile test

Table of pulling machine

Pulling direction

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Breadboards

Assembling, testing and exchanging of modules

Goals:

 Evaluation of manufacturing, alignment and assembly procedures

 Functional demonstration of stroke

 Swap modules

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Structure

1) Requirements 2) Schematics

3) Preliminary Design 4) Breadboards

5) Summary and Outlook

(20)

Summary

 Analysis of the requirements

 Development of the technical principle based on requirements

 Further development from the technical principle to the preliminary design

 Identification of critical technologies

 Definition of breadboards

Outlook

 Tests of the breadboards until end of 2017

 Assembly of a mirror demonstrator with 3 x 3 modules

 Technology is available from mid-2018, could be adapted to your needs!

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SWAP DM:

 Ø 450 mm

 11,000 actuators

 Actuator pitch 3.7 mm

 Interactuator stroke 1.2 µm

 Update rate 4 kHz

Thank you for your attention!

Referencias

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