The research presented in this thesis opened the door for future work. The following are some of the areas that can initiate from this research:
• Investigation of scanning arrays of hi-lo cavity backed patch antennas. • Determination of the bonding strength of the flip-chip patch antennas. • Investigation of methods to increase the accuracy of the final bonding
height of the flip-chip antennas to accurately reproduce simulated performance.
• Investigate the optimal heat, pressure and ultrasonic vibration settings for flip-chip bonding ceramic materials to Rogers RT/duroid 5880.
• Analysis of the surface roughness of the resulting ECCOSTOCK FPH foam layer, and development of techniques to reduce this roughness. Also to determine the effect of this surface roughness on millimeter-
• Creation of a method to metallise and process the top surface of the ECCOSTOCK FPH layer to enable the creation of the parasitic patch element.
• A demonstration of the integration of antennas developed in this thesis with packaged MMIC systems.
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