3. CUMPLIMENTACIÓN DE LA FICHA DE CAMPO
3.1. Ficha de rodal
> 1.123 Whilst a higher density of nickel vacancies increases the work-function of the films, which
may in turn improve the VOC of perovskite devices, this must be balanced with the density of
defect states at the NiOx|perovskite interface which act as non-radiative interfacial recombination
centres. Annealing metal oxides in metal rich environments has been demonstrated to fill metal vacancies. For example, Iza et al. demonstrated that annealing ZnO in a Zn-rich environment reduced the intensity of the PL peak attributed to zinc vacancies.294 This inspired experiments
annealing NiOx in a nickel rich environment with the aim to reduce the density of nickel vacancy
defects.
20 nm NiOx was deposited onto sputtered Ni films as the source of nickel. Initially films
were annealed in an argon furnace, however residual oxygen within the furnace resulted in complete oxidation of the stack to form transparent NiOx. To prevent this, films were instead
annealed face down onto Ni foil in a vacuum chamber for 3, 10 and 20 minutes at 700 ºC, 1 x 10- 3 mbar. XPS was used in two ways to determine whether nickel vacancies were filled during the
annealing; (i) by analysing the ratio of Ni2+/Ni3+ using the O 1s core level spectrum and (ii) by
studying the position of the Fermi level before and after annealing.
As mentioned previously, charge compensation on the formation of nickel vacancies results in Ni3+ formation.123 Electrons in oxygen bound to Ni3+ in the lattice have a different
binding energy (531 eV)295 to those in oxygen bound to Ni2+ (529 eV).123 Thus, the ratio of the
two peaks indicates the relative doping of the samples. Figure 10.16 a and b show the O 1s spectra for as deposited NiOx and after annealing for 20 minutes, whilst Figure 10.16c shows the fraction
of the O 1s signal corresponding to Ni2+ and Ni3+ against annealing time. The Ni3+ content of the
films increased relative to Ni2+ with annealing, from 41 % before annealing to > 50 % for all
annealing times. This means that the density of nickel vacancies increased with annealing. The aim of this experiment was to fill nickel vacancies; therefore, the experiment was unsuccessful.
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Figure 10.16 a) The XPS O 1s core level spectra of Ni|NiOx samples a) as deposited and b) after
annealing face-down on Ni foil under vacuum for 20 minutes. Figure c) shows the fraction contribution of the peaks at 529 eV (blue, corresponding to oxygen bound to Ni2+) and 531 eV
(green, corresponding to oxygen bound to Ni3+).
Evaluation of the Fermi level position could also be used to study changes in the density of nickel vacancies in NiOx; a reduction in the density of nickel vacancies would be expected to cause the
Fermi level to move closer to mid-gap corresponding to a lower level of p- type doping. The valence band spectra for as deposited and annealed samples were measured, and the valence band- Fermi level offset was approximated from the intercept of the gradient of the leading edge with the background. The values are presented in Table 10.3.
a) b)
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Table 10.3 The valence band to Fermi level offset for Ni|NiOx samples annealed face down on
Ni foil for 0 – 20 minutes, determined from the intercept of the leading edge of the valence band spectra with the background signal.
Anneal time / min VB – Ef / eV
0 0.59
3 0.94
10 0.97
20 0.92
With annealing, the valence band to Fermi level offset increased by > 300 meV, meaning it moved closer to mid-gap. However, an increase in intensity of sub-gap absorption was present for annealed samples, indicating the formation of defect states. Whilst the increase in Fermi level with annealing in a Ni- rich environment might suggest a reduction in density of nickel vacancies, the similar position of the Fermi level for all annealing times may be evidence of Fermi level pinning. Such pinning would be caused by a defect formed during the annealing process, supported by the increase in sub-gap signal above the band-edge. A similar shift in Fermi level was previously seen in vacuum annealing studies of NiOx, where the formation of oxygen
vacancies gave rise to Ni0 defects within the films which pinned the Fermi-level and caused an
increase in signal above the valence band edge.296 Meanwhile, defect computations have predicted
a low defect formation energy of ~1.2 eV for oxygen vacancies, with the defect level situated ~0.6 eV above the valence band edge.122 Thus, comparison with the literature indicates that Ni0
defects formed on annealing may have caused Fermi level pinning in the samples.
This was further supported by analysing the Ni 3p3/2 core level spectrum. Figure 10.17a shows the Ni 2p3/2 spectra of the Ni|NiOx films before (0 min) and after annealing for 3, 10 and
20 minutes. With annealing, broadening at the onset of the signal at ~853 eV occurred. Fitting of the spectra revealed that as well as the Ni2+ and Ni3+ peaks at binding energies 854 and 856 eV
(Figure 10.17b), a third peak centred at 853 eV emerged for annealed samples (Figure 10.17c). This has previously been attributed to metallic Ni0 in the literature.296 Note that the Ni0 signal at
853 eV was present in all annealed samples, and is presented as a percentage of the fitted Ni 3p3/2 spectrum in Figure 10.17d. The percentage of Ni0 was non-linear with annealing time, which may
have been due to overshooting or fluctuations of the heat tape (which had temperature fluctuations of up to ± 50 ºC). Metallic nickel may have formed due to oxygen loss (the formation of oxygen vacancies) under the annealing conditions.296 Whilst the samples were annealed face down on Ni
foil, the pressure at the sample surface would still be expected to be lower than atmospheric due to the vacuum conditions within the furnace (1 x 10-3 mbar). Thus, on oxygen vacancy formation,
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reduction of Ni2+ to Ni0 by the two resultant electrons in the lattice would be expected to maintain
charge neutrality.
Figure 10.17 a) The XPS Ni 2p3/2 core level spectra of Ni|NiOx samples as deposited (blue) and
after annealing face-down on Ni foil under vacuum for 3 min (green), 10 min (orange) and 20 min (red), b) the fitted Ni 2p3/2 spectrum of Ni|NiOx as-deposited, c) the fitted Ni 2p3/2 spectrum of Ni|NiOx after annealing for 10 minutes under vacuum face-down on Ni foil and d) the
percentage of Ni0 contributing towards the Ni 2p
3/2 core level spectra for as-deposited Ni|NiOx
samples and samples annealed under vacuum face-down on Ni foil for up to twenty minutes.
XPS data from these preliminary experiments showed that annealing Ni|NiOx films face down on
Ni foil at 700 ºC and 1 x 10-3 mbar for up to 20 minutes resulted in an increase in both Ni3+ and
Ni0 species within NiO
x. Whilst the origin of Ni0 was speculated to come from charge
compensation on formation of oxygen vacancies within the lattice, the overall finding was that this set of experiments were unsuccessful (i.e. filling of nickel vacancies did not occur). In a successful experiment, filling of nickel vacancies by annealing NiOx in a nickel rich environment
would cause an increase in the Ni2+ content of the films. Whilst it would be interesting to further
probe the reason behind the increase in both Ni3+ and Ni0 content under these annealing
conditions, it would be more useful in future to repeat the experiments (annealing NiOx in a Ni-
rich environment) in an inert atmosphere at 1 atm to eliminate (or reduce) the possibility of
a) b)
c)
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oxygen vacancy formation. This would require a furnace which can be fully evacuated to remove oxygen before filling with an inert gas such as argon; such equipment was not available when these experiments were carried out.